Congatec Introduces First Com-Hpc Mini Modules At Embedded World 2023

Congatec – a leading vendor of embedded and edge computing technology – will be presenting its comprehensive COM-HPC ecosystem at embedded worl 2023. The portfolio now ranges from high-performance COM-HPC Server-on- Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that are hardly larger than a credit card. Together with the accompanying tailored cooling solutions, carrier boards […]

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