SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307

 SHENMAO America, Inc. continues to innovate new solder pastes and is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly. JEP has the advantages of conventional solder paste and anisotropic […]

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