SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307
SHENMAO America, Inc. continues to innovate new solder pastes and is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly. JEP has the advantages of conventional solder paste and anisotropic […]
The post SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307 appeared first on Electronics For You.
from Electronics For You https://ift.tt/Zpork6q
Electronics, Electrical
Comments
Post a Comment