Robust Tacking Agent for Power Module Assembly
Indium Corporation has announced the release of its new adhesive solution named InTack. The solution is specially designed as a drop-in, robust tacking agent for power module assembly. It is a no-clean, no residue, a halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. According to the company, the InTACK […]
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Electronics, Electrical
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