Indium Corporation Introduces New Adhesive Solution for Semiconductor Applications

Indium Corporation is announcing the release of InTACK, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany. InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ […]

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