Ultrasonic 3D Sensor Featuring Infineon’s XENSIV MEMS Microphone

Its advanced algorithms enable robust, cost-effective and accurate 3D vision for robotics, autonomous driving and consumer electronics Toposens, a developer and manufacturer of sensor solutions has partnered up with Infineon Technologies AG to realise 3D obstacle detection and collision avoidance in autonomous systems. The easy-to-integrate 3D ultrasonic sensor called ECHO ONE DK leverages sound, machine […]

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