New High-Speed 3D Solder Paste Inspection Solution

Built on the award-winning TR7007 SII Plus Series, the new equipment can accurately inspect low solder bridges Test Research, Inc. (TRI) presents the new 3D high-speed solder paste inspection (SPI) solution TR7007 SII Ultra that can perform at an industry-leading speed of up to 180 cm2/sec. The TR7007 SII Ultra is built on the highly […]

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